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 Smart Integrated Electronic Systems

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ZigBee Integrated circuit design Machine-learning algorithms Noise measurement Test cost reduction Analog/RF integrated circuits FDSOI technology Time-domain analysis 3D integration Delays Three-dimensional integrated circuits Indirect test SEU Indirect testing Alternate test Competencies Integrated circuit modeling Reliability Carbon nanotube Integrated circuit reliability Side-channel analysis Calibration Process variability Carbon nanotube interconnects Integrated circuit noise Clocks Bioimpedance Power demand Thermal sensor Alternate testing Sensors Electrothermal analysis Evaluation Circuit faults Carbon nanotube CNT Test Low-cost measurements ATE programming Secure IC RF integrated circuits Digital signal processing BIST Interconnect Biosensor Carbon nanotubes COTS Built-In-Self-Test RF test Ensemble methods Three-dimensional displays Computer architecture MEMS Logic gates Accelerometer OQPSK Noise Design Phase noise Bioimpedance spectroscopy Brainstorming Education Test efficiency Security Magnetic tunneling Capacitors Advanced PMA STT-MRAM Interconnects Test confidence Fault tolerance Low power Analog and RF integrated circuits Phase shifter RSA 3D Bandwidth One bit acquisition Circuits Analog/IF signals CMOS 1-bit acquisition Copper Digital ATE Integrated circuit interconnections Switches Automatic test pattern generation Through-silicon vias CMOS memory circuits Analog signals Power supplies Analytical models Integrated circuit testing Specifications Monitoring Integrated circuits Circuit simulation Circuit SRAM Transistors Microprocessors Temperature distribution