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 Smart Integrated Electronic Systems

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Three-dimensional displays Calibration Noise RSA Transistors Noise measurement Test efficiency Monitoring Computer architecture One bit acquisition Advanced PMA STT-MRAM Thermal sensor Interconnects Beyond-CMOS devices Switches MEMS Accelerometer Indirect test Design Clocks Electrothermal simulation Self-oscillations Integrated circuit interconnections Integrated circuit testing Integrated circuit reliability OQPSK Low power ATE programming Through-silicon vias Edge artificial intelligence edge AI Neuromorphic computing Three-dimensional integrated circuits Carbon nanotubes Analog/RF integrated circuits Process variability Analog and RF integrated circuits Copper Time-domain analysis Digital signal processing ZigBee SRAM Ensemble methods Interconnect Vanadium dioxide Integrated circuit design Logic gates Secure IC 3D 1-bit acquisition Test Bandwidth Circuit faults Test confidence 3D integration CMOS Delays Alternate test Circuit simulation Reliability Security Temperature distribution EVM measurement Power supplies Fault tolerance Quantum computing FDSOI technology Machine-learning algorithms Phase shifter Specifications Analog signals RF integrated circuits Sensors Indirect testing Phase noise Wireless communication Electrothermal analysis Power demand Self-heating Biosensor Low-cost measurements Digital ATE Education Test cost reduction Pattern recognition Magnetic tunneling Side-channel analysis Integrated circuits Evaluation Technology computer-aided design TCAD Automatic test pattern generation Alternate testing Microprocessors Integrated circuit noise RF test Oscillatory neural networks ONN Bioimpedance spectroscopy SEU Bioimpedance Integrated circuit modeling Carbon nanotube